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    • Ceramic components

      Can provide submount, ceramic heat sink, ceramic capacitors, thin film resistors, metal patterns, pre-fabricated gold tin and other ceramic components products;

      Ceramic components are widely used, its features: high integration, small size;

      High line accuracy, providing excellent component performance ;

      Excellent temperature stability and frequency characteristics, the use of high frequency millimeter attenuator, cooling base.​

      Detailed introduction
      Ceramic components
    • Pre-fabricated AuSn solder

      Gold tin solder film:

      Au/Sn=70~80/30~20;

      Film thickness: 3 microns, 5 microns;

      Welding temperature: 290 ~ 320 ℃

      Detailed introduction
      Pre-fabricated AuSn solder
    • thin film resistors

      Thin film resistor materials: TaN, Pt, NiCr;

      Surface resistance: 10Ω / □, 50Ω / □, 100Ω / □

      Precision Tweezers: Laser Tweezers (0.5%)

      The minimum resistance of 1Ω, the maximum resistance of 50KΩ, accuracy of 5%, 10%, special accuracy of up to 0.5%.

      Precision coil inductance

      Detailed introduction
      thin film resistors
    • submount

      Side of the metal, product size 2.825 * 1 * 0.127, unit mm;

      The smallest can be done: 0.3 * 1 * 0.127.

      The cross-section and vertical alignment accuracy is ± 5 μm.

      Detailed introduction
      submount
    • Heat sink

      Its surface is metallized as Ti, Pt, Au, Cr, Cu, Sn, Ag or AuSn solder,

      Size, thickness and composition can be customized.

      Detailed introduction
      Heat sink

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    • +1 (408) 645-4137
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