Can provide submount, ceramic heat sink, ceramic capacitors, thin film resistors, metal patterns, pre-fabricated gold tin and other ceramic components products；
Ceramic components are widely used, its features: high integration, small size；
High line accuracy, providing excellent component performance ；
Excellent temperature stability and frequency characteristics, the use of high frequency millimeter attenuator, cooling base.
Communications Laser: microwave millimeter wave communication, optical communication, radio communication, high power laser;
LED high-power lighting field;
Sensing technology;
Medical Imaging;
Biotechnology field.
Typical devices include Lange coupling bridges, splitter filters, transmission lines, circulators, isolators, resistors
The size, the performance parameters can be customized according to customer needs.
A、Membrane structure: two kinds of metallized film series
Cr/Ni/Au=100~150nm/300~400nm/500~600nm、1200~1300nm、
2800~3000nm
Ti/Pt/Au=100~150nm/200~300nm/500~600nm、1200~1300nm、
2800~3000nm
B、Film-forming method:
Ion sputtering, ion assisted deposition
C、Graphic Technology:
Semiconductor lithography, laser etching technology;
Nano mask + photoresist technology；lift-off technology
Support in the alumina, aluminum nitride, beryllium oxide, ferrite, microwave substrate and some other ceramic substrate production line with the customer's special graphics requirements of the thin film integrated circuits.
Support fine lines, fine circuit production, ceramic edge profile, metallization, sidewall cladding, double-sided graphics circuit.
